Fanelli, Fiorenza and Lovascio, Sara and d'Agostino, Riccardo and Fracassi, Francesco (2012) Insights into the Atmospheric Pressure Plasma‐Enhanced Chemical Vapor Deposition of Thin Films from Methyldisiloxane Precursors. Plasma Processes and Polymers, 9 (11-12). pp. 1132-1143. ISSN 1612-8850
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Fanelli et al_MDSO_POSTPRINT.pdf - Accepted Version Available under License Creative Commons Attribution Non-commercial No Derivatives. Download (1MB) | Preview |
Abstract
This work describes the plasma-enhanced chemical vapor deposition of thin films at atmospheric pressure using dielectric barrier discharges fed with argon, oxygen and different methyldisiloxanes, i.e., hexamethyldisiloxane, pentamethyldisiloxane, and 1,1,3,3-tetramethyldisiloxane. The influence of the methyldisiloxane chemical structure and of the oxygen/methyldisiloxane feed ratio is investigated in order to provide insights into the organosilicon plasma chemistry at atmospheric pressure. As expected the FT-IR and XPS analyses show that the carbon content of the coatings depends on the number of methyl groups in the precursor molecule; in the case of coatings obtained with PMDSO and TMDSO carbon removal seems to be further enhanced by the presence of Si-H bonds. Gaschromatography-mass spectrometry analyses of the exhaust gas allows to assess the precursor depletion and to perform the quali-quantitative determination of by-products (e.g., silanes, siloxanes, silanols) formed by plasma activation. The results are exploited to rise hypotheses on the contribution of the different reaction pathways on the deposition mechanism.
| Item Type: | Article |
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| Uncontrolled Keywords: | Atmospheric pressure cold plasma; dielectric barrier discharge; methyldisiloxane; PE-CVD |
| Subjects: | 500 Scienze naturali e Matematica > 500.2 Scienze fisiche 500 Scienze naturali e Matematica > 540 Chimica e scienze connesse |
| Depositing User: | Fiorenza Fanelli |
| Date Deposited: | 02 Feb 2024 11:40 |
| Last Modified: | 02 Feb 2024 11:41 |
| URI: | http://eprints.bice.rm.cnr.it/id/eprint/22624 |
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